The Latest News from the SPEC Embedded Group

By Joseph Yiu, Embedded Group Chair

I’m pleased to share with you the first edition of the SPEC Embedded Group Newsletter, which will give us a regular opportunity to update the community on everything happening with SPEC Embedded Group (SPEC EG).

SPEC Embedded Group was created in October 2023 when EEMBC (Embedded Microprocessor Benchmark Consortium) was merged into SPEC. We are already moving forward in several directions, including working to update current benchmarks and starting to plan new ones:

• The AudioMark Benchmark Maintenance Update – The AudioMark benchmark is the first-of-its-kind audio benchmark that incorporates advanced signal processing, diverse data types, and a convolutional neural net in a single benchmark with a realistic code footprint. Released just a year ago, it's gaining popularity among developers. To address user feedback, we've released a maintenance release that includes bug fixes and improved documentation and more.
• The AutoBench 1.x Benchmark Suite Maintenance Update – The AutoBench benchmark suite enables users to predict the performance of microprocessors and microcontrollers in automotive, industrial, and general-purpose applications. AutoBench 1.1 remains popular for performance analysis on small, single-processor systems due to its compatibility with bare metal environments and lower memory requirements. We are working to deliver an updated AutoBench 1.2 benchmark suite, which will include several bug fixes.

It’s a quick read, but I think you’ll find the newsletter full of useful information. If you have any comments or suggestions, please let me know! And as always, we’re looking for more companies and organizations to join SPEC Embedded Group to help us shape the future of embedded systems technology, so please consider becoming a member.

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